Multiple Assemblies exist for SMTL entry 2gd5
Structural basis for budding by the ESCRTIII factor CHMP3; X-RAY DIFFRACTION 2.80 Å

	SMTL ID 2gd5.1 Ligands - Polypeptides Charged multivesicular body protein 3 Oligo-state homo-dimer
	SMTL ID 2gd5.2 Ligands - Polypeptides Charged multivesicular body protein 3 Oligo-state homo-dimer